The 1st International Workshop on Machine Learning for Autonomic System Operation in the Device-Edge-Cloud Continuum (MLSysOps 2023)
https://events.dimes.unical.it/mlsysops2023
Raffaele Gravina, University of Calabria, Italy
Spyros Lalis, University of Thessaly, Greece
Dimitris Chatzopoulos, University College Dublin, Ireland
To address the ever-increasing deluge of data collected and processed by computing systems, the trend of edge computing is establishing the effectiveness of processing data as close as possible to their source, often consisting of dense networks of wireless sensor nodes and IoT devices. It is predicted that by 2025 around 80% of enterprise data will be generated and processed outside the traditional cloud. In fact, edge computing is becoming even more attractive with the advent of energy-efficient micro-servers and powerful embedded devices with significant storage and processing capabilities. The advent of device-cloud-edge (D-E-C) computing aggravates the challenging task of managing heterogeneous and distributed resources, this time at an extreme scale, making human-in-the-loop management completely unrealistic. To achieve dynamic and flexible system and application management with minimal user involvement, the concept of autonomic computing systems was proposed as “computing systems that can manage themselves given high-level objectives from administrators”. However, the scale, heterogeneity, high dynamicity, and intrinsic local properties/variability of the continuum yields rule-based approaches – traditionally used in autonomic systems – insufficient. Machine learning-/AI-driven management is a promising alternative, but the quest to extend this to the full continuum faces several challenges such as scalability, heterogeneity, dynamics, trust & security, and transparency. The goal of the workshop is therefore to bring together a community of researchers and practitioners who study problems at the intersection of AI/ML, autonomic and cognitive computing, D-E-C continuum, distributed system operation, and resilient application deployment.
The 2nd International Workshop on Hybrid Internet of Everything Models for Industry 5.0 (HIEMI 2023)
https://hiemi2023.dii.univpm.it/
Francesco Cauteruccio, Polytechnic University of Marche, Italy
Enrico Corradini, Polytechnic University of Marche, Italy
Antonio Guerrieri, ICAR-CNR, Italy
Claudio Savaglio, University of Calabria, Italy
Domenico Ursino, Polytechnic University of Marche, Italy
Luca Virgili, Polytechnic University of Marche, Italy
At the heart of the Internet of Everything (IoE) model is the promise to bring together people, data, processes, and things, with the goal of improving existing processes and enhancing people’s lives. A crucial challenge in IoE is the shift from the “connections among things” paradigm to “connections among people, processes, data, and things”. Similarly, the concept of Industry 5.0 is gaining traction in the industrial ecosystem, with a need to increase productivity while keeping human workers involved in manufacturing processes. The solution is to create hybrid ecosystems that seamlessly integrate smart machines with humans as collaborators.
HIEMI 2023 aims to create a platform for the scientific and industrial communities to explore and evaluate innovative and hybrid models for IoE in Industry 5.0 ecosystems. The workshop aims to define a collaborative research agenda to highlight future research
directions in this rapidly advancing field, and to provide a timely opportunity to share new
ideas and developments that tackle well-known challenges and pose new ones. As the
intersection of Industry 5.0 and IoE gains more attention from academic and industrial
communities, HIEMI 2023 provides a platform to share knowledge, foster nterdisciplinary collaboration, and develop innovative solutions that can improve industrial ecosystems. The workshop is a unique opportunity to explore the potential of hybrid models that can integrate smart machines with humans as collaborators, enabling the creation of innovative ecosystems that can adapt to changing market demands.
The 2nd Workshop on Security and Privacy in Connected Embedded Systems (SPICES 2023)
https://www.tii.ae/workshop/spices
Martin Andreoni (Technology Innovation Institute, UAE)
Michael Baddeley (Technology Innovation Institute, UAE)
Javier Berrocal (University of Extremadura, Spain)
Gianluca Dini (University of Pisa, Italy)
Pericle Perazzo (University of Pisa, Italy)
Embedded systems have become pervasive in modern society: from managing the power grids that allow you to boil the kettle in the morning, to monitoring your sleep patterns at night. They play a crucial role in facilitating communication, enabling access to information, and powering the unseen minutiae of everyday life. Securing these networks and devices is of utmost importance to ensure the safety and privacy of individuals, businesses, and governments. However, despite significant recent progress in recognising the need for security in such systems, it is often still an afterthought. Furthermore, emerging communication technologies such as 6G, cloud computing, and the inexorable rise of Artificial Intelligence and Machine Learning present new security threats and privacy issues that require innovative solutions. Moreover, unconventional threats and
vulnerabilities can circumvent established security and privacy dogmas, thereby exposing key weaknesses in critical systems.
The Workshop on Security and Privacy in Connected Embedded Systems (SPICES) aims to address these challenges and foster interdisciplinary collaboration to explore innovative solutions for securing wireless and embedded systems. The workshop provides a platform for researchers, practitioners, and industry experts to discuss the latest topics and challenges in wireless and embedded systems security and privacy – not only on how existing systems should be secured, but exploring important security aspects (or lack of) in current research trends. We welcome submissions with unusual takes on existing techniques, proposals for novel security and privacy solutions, exposure of atypical weaknesses, and the application of unconventional approaches to solving next-generation wireless security challenges.
The 1st International Workshop on Trusted and Reliable Embedded Wireless Environments (TREWE 2023)
https://events.dimes.unical.it/trewe2023
Declan Delaney, University College Dublin, Ireland
Claudio Miceli de Farias, Federal University of Rio de Janeiro, Brasil
Domenico Rosaci, Univ. Mediterranea of Reggio Calabria, Italy
Giuseppe M.L. Sarnè, University Milan Bicocca, Italy
Embedded Wireless Devices (EWDs) are increasingly becoming pervasive, intelligent, and capable of supporting users with potentially useful services by operating both autonomously and in cooperation with each other or human users also across different environments. The rapid deployment of these devices has taken place at increasing risks for the security and reliability of the services and even more in the presence of open and distributed systems where most actors are mutually unreferenced with respect to their reliability and identity. Therefore, to ensure and promote the deployment of EWDs, there is an increasingly pressing need to create a comfortable atmosphere of trust in which they can operate safely, an essential requirement for all Human-To-Machine (H2M) as
well as Machine-To-Machine (M2M) interactions. EWD can adopt cryptographic techniques and/or trust and reputation systems, even working synergistically. The former is effective with respect to privacy and authentication issues, while the latter is particularly suitable to mitigate the risks of untrustworthy partners, regardless of their physical or virtual nature. Unfortunately, computational resources, memory, autonomy, and other constraints can be arduous obstacles to face, requiring specific approaches and expertise to reduce the vulnerabilities of EWDs to risks and threats. In this setting, several models and solutions dedicated to such environments have been developed, and the purpose of this workshop is to gather the most interesting and innovative proposals in the field of
embedded wireless devices.
