Conference topics
-
- Physics, chemistry and processing technologies of dielectrics
- Simulation and modeling of dielectrics, interfaces, 2D materials and thin films
- Characterization and reliability of dielectrics, interfaces, 2D materials and thin films
- Gate stack for advanced logic technologies
- Dielectrics for interconnects, MIM and 3D integration
- Dielectrics for high mobility substrates
- Dielectrics for 2D materials
- Advanced transistor architectures and relevant dielectrics
- Materials for conventional and emerging memories
- Materials for neuromorphic and in-memory computing
- Cryogenic electronics and quantum computing
- Ferroelectrics, functional oxides and topological insulators
- Dielectrics and thin film materials for TFTs, amorphous or organic devices
- Innovating devices with advanced insulators
- Materials for power devices
- Materials for high-frequency devices
- Materials for sensors and bioelectronics
- Materials for integrated photonics and photovoltaics
Accommodation
Available accommodations
Submission Deadlines
2-page camera ready abstracts:Notification of Acceptance: March 2023
4-page papers for the SSE special issue: March 27, 2023 (23:59 Pacific Time)
Download Call for Papers
Download Abstract Template
Submit via EasyChair
4-page versions of all accepted abstracts will be considered for publication in an open special issue of Solid-State Electronics “Letters from Insulating Films on Semiconductors 2023”. Authors of selected accepted INFOS2023 papers will be invited to submit full-length (7-10 pages) papers which will be published in another special issue of Solid-State Electronics “Selected papers from Insulating Films on Semiconductors 2023”.
The Best Student Paper Award will be delivered at the end of the conference.