Conference topics
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- Physics, chemistry and processing technologies of dielectrics
- Simulation and modeling of dielectrics, interfaces, 2D materials and thin films
- Characterization and reliability of dielectrics, interfaces, 2D materials and thin films
- Gate stack for advanced logic technologies
- Dielectrics for interconnects, MIM and 3D integration
- Dielectrics for high mobility substrates
- Dielectrics for 2D materials
- Advanced transistor architectures and relevant dielectrics
- Materials for conventional and emerging memories
- Materials for neuromorphic and in-memory computing
- Cryogenic electronics and quantum computing
- Ferroelectrics, functional oxides and topological insulators
- Dielectrics and thin film materials for TFTs, amorphous or organic devices
- Innovating devices with advanced insulators
- Materials for power devices
- Materials for high-frequency devices
- Materials for sensors and bioelectronics
- Materials for integrated photonics and photovoltaics
Invited Talks
Opening Keynote
Robert Chau
Intel Corporation, San Francisco, CA, United States
“Moore’s Law Device Scaling and 3D Heterogeneous Integration R&D for 2030+ Manufacturing”
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Laura Begon-Lours |
| IBM Research Zurich, Zurich, Switzerland | |
| “Ferroelectric synapses in neuromorphic circuits: integration of perovskite- and hafnia-based crossbars” | |
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Edward Yi Chang |
| National Yang Ming Chiao Tung University, Taiwan | |
| “E-mode GaN HEMT with Ferroelectric Gate Material for EV and PV Applications” | |
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Erika Covi |
| NaMLab gGmbH, Dresden, Germany | |
| “Integrating emerging devices with CMOS: building the bridge we need to cross” | |
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Giuseppe Iannaccone |
| University of Pisa, Pisa, Italy | |
| “The case for analog machine learning chips based on silicon and 2D materials: opportunities and challenges” |
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Ben Kaczer |
| IMEC, Leuven, Belgium | |
| “Gate oxide reliability: upcoming trends, challenges and opportunities” | |
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Federico Nardi |
| Applied Materials, Reggio Emilia, Italy | |
| “Atomic defect spectroscopy for MIM and MOS systems” | |
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Walter Schwarzenbach |
| Soitec SA, Grenoble, France | |
| “SmartSiCTM for high-voltage power applications” | |
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William Vandenberghe |
| University of Texas, Dallas, USA | |
| “van der Waals dielectrics suitable for 2D transistors” | |
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Hitoshi Wakabayashi |
| Tokyo Institute of Technology, Tokio, Japan | |
| “2D-FET Technologies for p/n-Vertically-Stacked FETs and Thermoelectric Devices” | |
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Program
Final program at a glance and final program are now available!!
Main social events:
– Welcome “Tartufo” Ice Cream at Pizzo (VV) on Tuesday, 27 June 2023 (after dinner)
– Social Tour and Social Dinner at Tropea (VV), the “Pearl of the Tyrrhenian Sea”, on Thursday, 29 June 2023
Accommodation
The booking service is now available!
Click here to book at special rates (reserved for attendees and their accompanying persons regularly registered for the conference):
- accommodation at the "TUI MAGIC LIFE Calabria" resort, Pizzo (VV), Tyrrhenian coast, Calabria, Italy, in an all-inclusive formula (including lunch and dinner, unlimited access to the bar, access to all sports activities, use of the swimming pool and other entertainment facilities);
- arrival and/or departure transfer service from/to the Lamezia Terme International Airport (IATA code: SUF), 17 km away from the resort and well connected with both Milan and Rome airports, and from/to the Lamezia Terme Central Railway Station, 15 km away from the resort;
- daily pass (including lunch, unlimited access to the bar, access to all sports activities, use of the swimming pool and other entertainment facilities), which is mandatory for guests with no-stay at the "TUI MAGIC LIFE Calabria" resort.
The BOOKING SERVICE is managed by Calabriatour.net Srls event management agency. For any requests and additional information, please contact:
We look forward to your participation in INFOS 2023!
Submission Deadlines
2-page camera ready abstracts:Notification of Acceptance: March 2023
4-page papers for the SSE special issue:
Download Call for Papers
Download Abstract Template
Submit via EasyChair
4-page versions of all accepted abstracts will be considered for publication in an open special issue of Solid-State Electronics “Letters from Insulating Films on Semiconductors 2023”. Authors of selected accepted INFOS2023 papers will be invited to submit full-length (7-10 pages) papers which will be published in another special issue of Solid-State Electronics “Selected papers from Insulating Films on Semiconductors 2023”.
The Best Student Paper Award will be delivered at the end of the conference.
Registration
| Early registration (by 12 May 2023) |
Regular registration (from 13 May 2023) |
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| Full Registration* | 450 € | 500 € |
| Student Registration* | 350 € | 400 € |
| Accompanying Person ** | 120 € | 150 € |
| * includes congress kit, coffee breaks, social events | ||
| ** includes only social events | ||
The online system for the registration fee payment is now available! Click on “REGISTER NOW”, select
INFOS 2023 in the payment portal and then click on “PAY NOW”.
General info about registration, fee payment and invoice:
- one author registration can cover a maximum of 2 contributions (oral or poster);
- in the registration form, use the “Special requirements” field to specify any requests about the header of your invoice;
- registration fee payment via Visa/MasterCard credit cards or bank transfer is allowed;
- in the case of fee payment via Visa/MasterCard credit cards (select “Pay now” in the payment portal), 2.9% processing fee will be applied and you will find a note “Visa/MasterCard processing fee (2.9% of total amount)” in your invoice;
- in the case of fee payment via bank transfer (select “Pay later” in the payment portal), you will find the bank account details once registration is completed;
- when including the fee for one or more accompanying persons in your payment, you will receive a single invoice with two distinct items for the registration fee and the fee referring to accompanying persons.
